The model you provided, "XC7Z100-2FFG900I," corresponds to the Xilinx brand, which is known for its programmable logic devices. Specifically, this model is part of the Zynq-7000 series, which integrates a ARM Cortex-A9 processor and programmable logic ( FPGA ). The "2FFG900I" designation describes the speed grade, the package type, and the temperature range of the device.
Package Type
Package Type: FFG900 Pin Count: 900 pins Package Size: 35mm x 35mm (Fine-Pitch Ball Grid Array)Pin Function List and Description (Detailed Pinout)
Below is the detailed pinout and pin functionality for the XC7Z100-2FFG900I. Since the device has 900 pins, the pinout will be split into sections.
Pinout Section Example (Partial): Pin # Pin Name Function Description Signal Type 1 GND Ground pin, used for reference ground. Ground 2 VCCO Power supply pin for I/O banks. Power 3 MIO0 Multiplexed I/O pin, part of the ARM Cortex-A9. General I/O 4 MIO1 Multiplexed I/O pin, part of the ARM Cortex-A9. General I/O 5 MIO2 Multiplexed I/O pin, part of the ARM Cortex-A9. General I/O 6 MIO3 Multiplexed I/O pin, part of the ARM Cortex-A9. General I/O 7 GND Ground pin, used for reference ground. Ground 8 VCCO Power supply pin for I/O banks. Power 9 TDI Test Data In (JTAG interface ). JTAG 10 TDO Test Data Out (JTAG interface). JTAG … … … …The table will continue for all 900 pins.
Circuit Principle and Description
The XC7Z100-2FFG900I integrates several important functions:
Processing System (PS): This contains a dual-core ARM Cortex-A9 processor with a hardwired Memory controller and various peripherals. Programmable Logic (PL): This FPGA logic section allows for custom logic design, interfacing with the PS and external peripherals. JTAG Interface: Provides test access to the internal circuits for debugging and programming. I/O Banks: These support various voltage levels, making the device versatile for different signal standards. Memory Interfaces: Supports high-speed memory interfaces like DDR3, SDRAM, and other memory standards.20 Common FAQ (Frequently Asked Questions) for XC7Z100-2FFG900I
Q: What is the maximum clock frequency of the ARM Cortex-A9 processor in the XC7Z100-2FFG900I? A: The ARM Cortex-A9 processor in the XC7Z100-2FFG900I can operate up to 1 GHz.
Q: What is the operating voltage range for the XC7Z100-2FFG900I? A: The XC7Z100-2FFG900I operates with a supply voltage range of 1.0V to 1.8V for the core and 1.8V to 3.3V for I/O banks.
Q: How many general-purpose I/O pins are available in the XC7Z100-2FFG900I? A: There are up to 540 general-purpose I/O pins in the XC7Z100-2FFG900I.
Q: What is the thermal performance of the XC7Z100-2FFG900I? A: The device is rated for an industrial temperature range of -40°C to +100°C.
Q: What package options are available for the XC7Z100-2FFG900I? A: The XC7Z100-2FFG900I comes in the FFG900 package, which is a 900-ball FBGA (Fine-Pitch Ball Grid Array) package.
Q: How many transceiver s does the XC7Z100-2FFG900I include? A: The XC7Z100-2FFG900I includes 12 high-speed transceivers.
Q: Can the programmable logic section be used without the ARM Cortex-A9 processor? A: Yes, the programmable logic (FPGA) section can be used independently for custom designs.
Q: What is the memory interface support of the XC7Z100-2FFG900I? A: The device supports DDR3, LPDDR2, and SDRAM interfaces for high-speed memory.
Q: What is the power consumption of the XC7Z100-2FFG900I? A: Power consumption depends on the design, but it typically ranges from 10W to 20W depending on the clock speed and usage of programmable logic.
Q: What is the typical application for the XC7Z100-2FFG900I? A: Typical applications include embedded systems, communication equipment, automotive control systems, and industrial automation.
Q: How many PLLs (Phase-Locked Loops) are available in the XC7Z100-2FFG900I? A: The XC7Z100-2FFG900I includes 8 PLLs for clock management.
Q: Is there support for external memory devices like NAND flash? A: Yes, the device supports external memory interfaces, including NAND flash, through its programmable logic section.
Q: What programming tools are required for the XC7Z100-2FFG900I? A: The device can be programmed using Xilinx's Vivado Design Suite, which includes tools for hardware design, verification, and synthesis.
Q: Does the XC7Z100-2FFG900I support Ethernet connectivity? A: Yes, the device supports Ethernet connectivity via the ARM processor and external PHY (Physical Layer) interface.
Q: How is the XC7Z100-2FFG900I configured? A: The device can be configured using an external configuration memory or through JTAG programming.
Q: Can the XC7Z100-2FFG900I be used for high-speed data acquisition? A: Yes, with its high-speed transceivers and programmable logic, it is suitable for high-speed data acquisition systems.
Q: What debugging features are available for the XC7Z100-2FFG900I? A: The device includes JTAG access, integrated debugging tools, and hardware trace for both the ARM processor and the FPGA section.
Q: What is the maximum I/O voltage level supported by the XC7Z100-2FFG900I? A: The I/O voltage level can be as high as 3.3V for certain I/O banks.
Q: Does the XC7Z100-2FFG900I support wireless communication? A: Wireless communication can be implemented using external module s interfacing with the programmable logic or ARM processor.
Q: How can I reduce power consumption on the XC7Z100-2FFG900I? A: Power consumption can be reduced by using low-power modes, optimizing clock speeds, and using efficient FPGA designs that minimize logic usage.
This is a general overview of the XC7Z100-2FFG900I with respect to pin functions, package details, and common FAQs. If you need a fully detailed 900-pin list or a more in-depth technical report with specific pinout diagrams, Xilinx's official datasheets and design guides are the best sources for precise information.
